dsec?50?01?l?07.0?2?ra dsec?30?01?s?07.0?2?ra accepts (1,60mm) .062" pcb thicknesses rugged edge rate ? contacts designed for signal integrity solder charged terminations for easy board processing (0,80mm) .0315" pitch right angle orientation www.samtec.com www.samtec.com f-209-2 for complete speci cations and recommended pcb layouts see www.samtec.com? dsec insulator material: black liquid crystal polymer contact: copper alloy plating: au or sn over 50? (1,27?) ni current rating: testing now! operating temp: -55? to +125? card insertion depth: (5,94mm) .234" nominal rohs compliant: ye s processing: max processing temp: 230? for 60 seconds, or 260? for 20 seconds 3x lead?free solderable: ye s dual stack edge card note: some lengths, styles and options are non-standard, non-returnable. specifications ?l = 10" (0,25m) gold on contact, matte tin on tail ?s = 30" (0,76m) gold on contact, matte tin on tail no. of positions dsec lead style solder type ra ?30, ?40, ?50 (per row) ?01 = (1,60mm) .062" thick card ?05.5 = (5.5mm) .217" ?07.0 = (7mm) .276" ?2 = lead-free tin alloy 96.5% sn/ 3% ag/.5% cu solder crimp plating option board spacing dsec series (0,80) .0315 (12, 9 6) .510 (0,64) .025 ( 9 ,00) .354 (1,32) .052 dia no. of positions x (0,80) .0315 + (7,75) .305 no. of positions x (0,80) .0315 + (5,72) .225 (13,60) .535 (2,15) .085 (3,30) .130 (1,15) .045 application application mates with: 1,60mm (.062") thick cards, hsc8, hsf8 also available ?tin-lead solder charge ? other card spacings ? single card elevated call samtec. board spacing ?05.5 ?07.0 (5,50) .217 (7,00) .276 a a (13 6 rd n 55 0 a d 5,50) .21 00) .276 b pa
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